Business and Investment Development Agency

Czech Semicon Days


The Czech Investment Forum 2026: Semiconductors for Future Mobility is organised as part of the broader initiative Czech Semicon Days, dedicated to the development of the semiconductor sector and its strategic role within the European economy.

This week‑long platform brings together key stakeholders from the semiconductor industry, related industrial sectors, public authorities and research institutions. The 2026 edition will place particular emphasis on modern and future‑oriented mobility. This year we build on the success of the previous year and we aim to reflect the shared priorities of the Czech Republic and the European Union in strengthening strategic autonomy, innovation capacity and the resilience of the semiconductor ecosystem. 

 

You can find more information here.

Watch the recording of the live stream from the morning session of the Czech Investment Forum conference.

Get inspired by presentations from Czech and international experts discussing the future of the semiconductor ecosystem, innovations, and strategic investments in this rapidly growing industry. Don’t miss insights from leading professionals on current trends, technological development, and opportunities for Czechia in the semiconductor sector.

Conference program

18 May 2026 Supplier Day

Space for dialog across the semiconductor supply chain enabling suppliers, manufacturers, and ecosystem partners to connect, build strategic partnerships and discuss new business opportunities.
This Supplier Day offers a unique platform to meet key industry players, explore collaboration potential, and position your company within the rapidly evolving semiconductor ecosystem. Engage directly with decision-makers, discover upcoming projects and procurement needs, and strengthen your presence in one of Europe’s most strategic industrial sectors.
 

Participants will meet with experts from EUROPEAN PASSIVE COMPONENTS INSTITUTE and International Microelectronics and Packaging Society – IMAPS CZ/SK and join Supply Chain Management seminar. Flash presentation will introduce key manufacturers of technologies for semiconductor manufacturing.
Participation in the workshop is free, but the number of places is limited, therefore registration is required.
 

Program

8:30 Registration
9:00 Opening of Czech Semicon Days - Jan Michal CEO and general director
9:05 Supplier Day Opening - David Müller, Director General at the Section of European Union and Foreign Trade, Ministry of Industry and Trade
9:10 Czech Semiconductor Center - Karel Masařík, RISC-V Fellow, Czech Semiconductor Center
9:25 Passive Components Development Requirement in Consequence of Semiconductor Trends/European Passive Components Institute/ -       Tomáš Zedníček, President and Founder of EPCI – European Passive Components Institute 
9:40 International Microelectronics and Packaging Society /IMAPS CZ/SK/ - Alexandr Otáhal, President of the IMAPS Czech & Slovak Chapter 

MAIN CONFERENCE HALL:
9:55 – 10:55 Supplier introduction
– flash presentation 5 minutes per company
 

MEETING ROOMS:
Programme for development of semiconductor suppliers /seminars and consultations/
 

Meeting Room Silesia
9:55 – 10:55 Seminar on Supplier Financing and Insurance in the Semiconductor Industry followed by individual consultations.

Programme in Czech Language only

Česká exportní banka seminář (15 min): Možnosti úvěrování dodavatelů v polovodičovém průmyslu
Seminář představí možnosti financování a pojištění vývozu a investic českých dodavatelů v polovodičovém průmyslu. ČEB rozebere financování vývozu, investic, provozních potřeb a akvizic. Vysvětlí fungování dodavatelských/odběratelských úvěrů, investičních úvěrů, produktů trade finance i podpory českých vývozně orientovaných podniků. EGAP přiblíží nástroje pojištění exportních pohledávek, dodavatelských úvěrů a bankovních záruk, stejně jako podporu vývozně orientovaných podniků při financování rozvoje výroby a investic či pojištění samotných investic v zahraničí. Po prezentacích bude následovat prostor pro individuální konzultace konkrétních obchodních a investičních záměrů.
Lectured by: Miroslav Stříbrný, Director of the Trade and Export Finance Division, Czech Export Bank
 

The seminar will present financing and insurance options for exports and investments by Czech suppliers in the semiconductor industry. ČEB will discuss financing for exports, investments, working capital, and acquisitions. It will explain how supplier/buyer credits, investment loans, trade finance products, and support for Czech export-oriented companies work. EGAP will outline tools for insuring export receivables, supplier credits, and bank guarantees, as well as support for export-oriented companies in financing production development and investments or insuring the investments themselves abroad. The presentations will be followed by an opportunity for individual consultations on specific business and investment plans.
Export Bank (CEB) is a specialised state-owned banking institution, part of the system of state export support and economic diplomacy of the Czech Republic, helps Czech exporters and investors to grow and succeed on international markets as well as international customers to purchase Czech products, technological units and services.
 

Programme in Czech Language only

EGAP seminář (15 min): Možnosti pojištění a financování dodavatelů v polovodičovém průmyslu – role EGAP
Seminář představí možnosti pojištění exportu a investic českých dodavatelů v polovodičovém průmyslu. EGAP přiblíží nástroje pojištění exportních pohledávek, dodavatelských úvěrů a bankovních záruk, stejně jako podporu exportně orientovaných podniků při financování rozvoje výroby a investic či pojištění samotných investic v zahraničí.
Lectured by: Jan Dubec, Director of the Department of Acquisitions and Supplier Credit Insurance, EGAP
 

The seminar will present insurance options for exports and investments by Czech suppliers in the semiconductor industry. EGAP will outline its tools for insuring export receivables, supplier credits, and bank guarantees, as well as support for export-oriented companies in financing production development and investments, or insuring the investments abroad.
Export Guarantee and Insurance Corporation (EGAP)
A fully state-owned joint stock company providing services to Czech exporters and investors. EGAP fills gaps in  export and investment finance market and enhances the ability of exporters and investors to adapt to dynamic developments and challenges in a globalised trading environment.
 

Po krátké prezentaci bude následovat prostor pro individuální konzultace konkrétních obchodních a investičních záměrů.
 

11:00 – 11.45 Financování inovací v polovodičovém průmyslu: daňové odpočty a dotační příležitosti Grant Thornton – Association for Foreign Investments

Prezentace Grant Thornton představí možnosti využití vybraných přímých finančních podpor v polovodičovém průmyslu, kterému s ohledem na současný rostoucí význam celého odvětví věnuje veřejný sektor zvýšenou pozornost. Přednášející rozeberou možnosti daňových odpočtů ve výzkumu a vývoji prostřednictvím odčitatelných položek. Dozvíte se, k čemu slouží odpočet na VaV, kdo jej může uplatnit a jaké přináší daňové úspory. Prakticky vysvětlíme podmínky, časté chyby i přínosy pro firmy realizující inovace. Obdobně pak přednášející představí pilotní dotační výzvy v rámci platformy STEP zaměřené jak na financování VaV, tak také nové možnosti v oblasti spolufinancování produktivních investic. Po prezentacích bude následovat prostor pro individuální konzultace konkrétních záměrů.
Lectured by: Petra Vaněčková – Tax Partner; Ondřej Miffek – Head of Dotace | Advisory
 

Seminar followed by individual consultations.
Contribution of an AFI Member
 

Meeting Room Moravia
10:00 Decoding the Semiconductor Supply Chain – English
Lectured by: Lee Eden, Partner at Pacellico, Planning, Supply Chain, Digitalization
The Semiconductor industry is highly cyclical with extreme peaks and troughs of demand. Will AI continue to drive high levels of growth, will geopolitical issues drive the global economy into recession, will EV transition accelerate? Whichever trend dominates, as a semiconductor supplier you will need the processes and tools to build flexibility in your supply-chain and in-house capacity. In this session we will discuss how best to do that, and how to profit and succeed in this challenging environment.
 

10:45 Semiconductor Industry:  Technology Drivers, Quality and Compliance – English
Lectured by: Hugh Kelly, Managing Partner Pacellico
Semiconductor customers demand that rigorous protocols are followed to safeguard product quality, supply chain integrity, and protect the facilities that produce their products. This session explores these requirements by navigating through supplier selections, material equivalencies, compliance, and change management structures that ensure continuity of supply. Finally, a look to the future and how rapid advances in technology and shifting demand may influence supply chains over the next 5-10 years.
 

18 May 2026 Talent Development & Technology Transfer

Seminar primarily for representatives of universities, research centres, regional & local govenments, regional development agencies & inovation centres, and companies interested in talent development and technology transfer. How has Taiwan tackled these important topics to support its semiconductor companies? The joint Talent and Innovation Center of National Yang Ming Chiao Tung University and University of Arizona in Phoenix will be also presented as an example of good practice and international collaboration.
 

Presenters:

Dr. Ching-Yao (Hank) Huang, Vice President for the Office of Industry-Academia Co-creation, National Yang Ming Chiao Tung University
 

Participation in the workshop is free, but the number of places is limited, therefore registration is required.


Program

9:30 - 10:00

Registration

 

10:00 - 10:10

Welcome: CzechInvest

 

10:10 - 10:50

Semiconductor and Co-creation Strategies at National Yang Ming Chiao Tung University (NYCU)

Presenter: Dr. Ching-Yao Huang, Vice President, Office of Industrial-Academia Co-creation, NYCU


10:50 - 11:00

Coffee Break

 

11:00 - 12:00

International Semiconductor Co-creation Case Studies: Japan and the US

Presenter: Dr. Ching-Yao Huang, Vice President, Office of Industrial-Academia Co-creation, NYCU


12:00 - 12:30

Discussion & End of the Seminar

18 May 2026 Czech Semiconductor Ecosystem Development Day (in German & Czech only)

Seminář o rozvoji regionálních/místních ekosystémů pro polovodičový sektor

Seminář pro zástupce regionů a měst, středních a vysokých škol, regionálních rozvojových agentur nebo developerů průmyslových nemovitostí.

Co je potřeba udělat pro zdárný rozvoj příznivého ekosystému v regionech nebo městech kde už polovodičový sektor existuje, nebo je šance, že by se tam mohl rozvinout díky novým investicím v České republice a okolních zemích?

Jak v regionech jako Sasko-Anhaltsko, nebo Korutany zareagovali na predikce boomu polovodičového sektoru a začali posilovat kapacity pro vzdělávání, rekvalifikace, výzkum a vývoj, místní dopravní infrastrukturu, průmyslové parky pro dodavatele, nebo residenční bydlení?

 

Účast na semináři je zdarma, ale počet míst je omezen, proto je vyžadována registrace účastníků a pořadatel si vyhrazuje právo registraci potvrdit nebo nepotvrdit.

Prezentace zahraničních přednášejících a krátká diskuze na konci každé prezentace budou tlumočeny němčiny do češtiny a obráceně.

 

Program

13:30 - 14:00 Registrace

14:00 - 14:10 Uvítání - Jan Michal, generální ředitel, CzechInvest

14:10 - 14:20 Zahájení - Eduard Muřický, vrchní ředitel sekce hospodářství, Ministerstvo průmyslu a obchodu

14:20 - 15:20 Jak se spolková země Sasko-Anhaltsko připravovala na investici firmy INTEL, část 1 - Jürgen Ude, Státní tajemník pro strukturální změny a velké průmyslové projekty


15:20 - 15:30 Přestávka


15:30 - 16:10 Jak se spolková země Sasko-Anhaltsko připravovala na investici firmy INTEL, část 2 - Dr. Lioudmila Chatalova, Policy Officer, Státní kancléřství Saska-Anhaltska

16:10 - 17:00 Příprava průmyslového parku High-Tech Park Saxony-Anhalt - Julia Bütow, ředitelka parku

17:00 - 17:30 Nizozemský polovodičový průmysl a ekosystém - Peter-Jan Hendrikx, Vedoucí divize polovodičů, High Tech NL

17:30 - 18:00 Závěr akce a networking

19 May 2026 Czech Investment Forum

This event promises to be a fantastic opportunity to connect with semiconductor industry leaders, academic experts, and government representatives.
 

Program

8:30 Registration
9:00 Words of welcome - Jan Michal CEO and general director
9:05 Opening speeches - Karel Havlíček, 1st Deputy Prime Minister and Minister of Industry and Trade, Jan Rafaj, President of Confederation of Industry, Henna Virkkunen, European Commission Executive Vice-President for Technological Sovereignty, Security and Democracy (video message)

9:30 Block 1: Semiconductors for future mobility
Presentation: Jan Jakůbek, Chief Scientist and Co-founder, ADVACAM
Presentation: Philipp Pfingstag, Partner in Stuttgart office, McKinsey & Company
 
Panel discussion:
Rainer Käsmaier, Managing Director Semiconductors, Hitachi Energy
Armin Kemna, Vice-president Product Development, Elmos
Hugh Kelly, Co-Founder and Partner, Pacellico

10:30 Foreword to the Memorandum
Mina Noor, H.E. Mina Noor, Ambassador of the Kingdom of the Netherlands to the Czech Republic
Memorandum of Understanding Signing Ceremony
Representatives of the Czech National Semiconductor Cluster and the Dutch organization High Tech NL will sign a Memorandum of Understanding on cooperation in the semiconductor sector.
 

10:45 Coffee Break

11:05 Block 2: The road to effective industry-academia collaboration
Key Note: Yuan-Chen (Jack) Sun, Dean of the Industry Academia Innovation School at National Yang Ming Chiao Tung University and former CTO of TSMC
 
Panel discussion
Lukas Zilich, Senior Project Manager at Bayern Innovativ GmbH/ Bayern Chips Alliance 
Frank Bösenberg, Managing Director of Silicon Saxony
Dr. Ching-Yao (Hank) Huang, Vice President for the Office of Industry-Academia Co-creation, National Yang Ming Chiao Tung University
Karel Masařík, RISC-V Fellow, Czech Semiconductor Center

12:00 Block 3: Semiconductor Ecosystem Case Studies
 
Case study 1: onsemi – University of Tomáš Baťa: New study program for semiconductors
Jiří Stružka (onsemi)
Petr Slobodian  (University of Tomáš Baťa)
Case study 2: Collaborative Innovation: Leveraging Fraunhofer’s 300mm  Infrastructure for Industry & Academia
Martin Landgraf
Case study 3: HiLase – Laser based processes for semiconductor industry
Sanin Zulic
Case study 4: Creating Higher Education-Industry Programmes for  the Semiconductor Industry of Europe, Advanced Chip Design Research  Center 
Jiří Háze
Case study 5: Project CERKA Trojanovice – Future Center for Business and Technology, prototyping and incubation of innovative ideas in semiconductor technology sector
Adéla Píchová 
 

Flash presentation of IPCEI projects: 
Codasip: From Fixed to Flexible: Rethinking How Processors Are Made, Petr Svítil
Mycroft mind: Autonomous Edge AI: The Future of Smart Technologies in Semiconductors, Tomas Bort 
UJP: New technologies for radiation-resistant microelectronics, Milan Semmler 
NXP: Safety and Connectivity Software Stacks, David Švrček
 

13:10 Lunch break

14:00 Main Partner Introduction - Blake Wittman, Vice-Chairman of the Steereing Committee of AFI & Co-Owner of GoodCall
 

14:05 Block 4: Resilient semiconductor ecosystems: Czech and European Perspective
Key Note: Stanislav Černý, President of Czech National Semiconductor Cluster 
Presentation: Jan Lehký, Partner and Head of ESG, Kinstellar
 
Presentation of Analysis:  
Knowledge dynamics and technological relatedness in European semiconductor industry, Jana Vlčková, Viktor Květoň
 
Panel discussion:  
Peter-Jan Hendrikx, Head of the Semiconductor Division, High Tech NL
Thomas Horn, Managing Director, Saxony Economic Development Corporation (Wirtschaftsförderung Sachsen GmbH) 
Stanislav Černý, President of Czech National Semiconductor Cluster 

15:10 Block 5: Regional and academic hubs for semiconductor innovation
Key Note: Dr. Robert Gfrerer, Silicon Europe Chair, Silicon Alps
 
Introduction of regions and universities 5 minute each
South Moravian Region 
South Moravian Innovation Centre (JIC) – David Uhlíř  
 

Moravian-Silesian Region
A Hub for the Semiconductor Future  – Václav Palička, CEO Moravian-Silesian Investment and Development Agency (MSID); Adéla Hradilová, CEO  Moravian-Silesian Innovation Center (MSIC)
Technical University of Ostrava (VSB): Driving Innovation in Semiconductors: Materials,  Equipment, and Technologies – Zuzana Gelnárová
 

Zlín Region 
Technology Inovation Center Zlín –  Eva Gavendová (Project SILVA) 
 

Prague and Central Bohemia Region 
Central Bohemian Innovation Center (SIC) – Tomáš Martoch, Head of Regional Innovation  Strategy Team
Czech Technical University in Prague (CTU FEE) – Jiří Jakovenko, Vice-Dean for Master’s  Studies at the Faculty of Electrical Engineering
 

Usti Region  
Innovation Center of the Ústí Region – Tomáš Sivíček 
University of Jan Evangelista Purkyně (UJEP): Chemicals for Semiconductor Industry – Martin Babor
 

Liberec Region
Liberec Regional Development Agency: The Liberec Region – a Strong Partner for the Semiconductor Industry, Adam Soltan
 

Bonus:  Invitation to National Technical Museum – Ondřej Dostál, Ph.D., Officer for International Cooperation  National Technical Museum 
 

16:10   Closing Remarks & Networking

20 May 2026 Advance Chip Design Research Center – Exploring Silicon Brno

Director of Advanced Chip Design Research Center (ACDRC), Dr. Jiří Háze invites participants to a full-day guided tour in Brno, showcasing cutting-edge semiconductor research and activities at leading Czech universities.

The programme includes visits to Masaryk University and Brno University of Technology, presentations of ongoing chip design and semiconductor initiatives, and guided tours of laboratories, offering a unique insight into the academic backbone of the Czech semiconductor ecosystem.

 

Program

9:00 - 11:00 guided tour of Masaryk University 

 

11:30 - 12:30 lunch at Brno University of Technology Campus 

 

12:30 - 16:00 guided tour of Brno University of Technology 

20 May 2026 Czech–Saxon Partnership for Innovation: Funding Opportunities for Academia and Industry

Matchmaking Event: Funding for Czech-Saxony R&D Cooperation between Companies and Research Organizations
 
Technology Focus Digital Technologies: Semiconductors, Smart Mobility, AI, Cybersecurity, Smart Manufacturing
 

For representatives of:
Small and medium-sized enterprises (SMEs)
Large companies interested in cooperating with SMEs
Research organizations

What’s in it for you?:
Meet potential partners from Czechia and Saxony for joint R&D collaboration
Learn about current funding opportunities for R&D and how to benefit from them
Showcase your company’s competencies and share project ideas for partnership

Funding Framework
SMEs can receive funding for R&D development and experimentation, including software development:
In Germany: Up to 60% of costs; grants of up to 336,000€ per SME and up to 3,000,000€ per project
In Czechia: Up to 80% of costs; grants ranging from 120,000€ to 2,000,000€ per project/SME (if the SME is the sole applicant)

Research organizations can receive funding only if collaborating with SMEs:
Up to 100 % of costs in Germany
Up to 85 % of costs in Czechia
Funding is provided through the ZIM – Kooperationsprojekte program (Germany) and the Aplikace – International Collaboration program (Czechia).
 
3-minute pitches (2 slides: company presentation and joint project ideas) welcome: please send them in advance to: research@czechinvest.gov.cz
Please send your contributions till 13th of May at the latest.     First-come – first-served basis!
 
Language of the event: English
 
Partners: Ministry of Industry and Trade, Wirtschaftsförderung Sachsen, Industrie- und Handelskammer Dresden: Kompetenzzentrum Tschechien

Program

9:30 - 10:00  Welcome and Coffee
10:00 - 11:30 Funding Opportunities - IraSME Funding Framework – presenation of the IraSME network / ZIM Kooperationsprojekte - Funding Scheme in Germany / Aplikace – International Cooperation - Funding Scheme in Czechia

11:30 - 12:15 Lunch Break

12:15 - 14:00 Pitching and Networking - Pitching Session - to present a collaboration idea (3-minute pitch, 1 slide / Facilitated Networking / Closing remarks
14:00 - 15:00 Informal networking possible

20 May 2026 Chemicals4Semiconductors

Worskshop for representatives of chemicals companies, universities, local and regiéonal governments, regional development agencies, etc.

The chemicals industry i sone of the most important suppliers to the production of semiconductors but this sector has specific requirements for chemicals and technical gases. The current growth of the semiconductor industry in Europe brings opportunities not only for chemicals producers, but also for universities or secondary technical schools.

Join us in the discussion of requirements, needs, and opportunities.

Participation in the workshop is free but the seating capacity is limited. Prior registration is required. The workshop will be in English.

 

Program

9:30 - 10:00  Registration

10:00 - 10:15 Welcome: UJEP, ICUK & CzechInvest

10:15 - 10:45 Keynote: Chemicals for Semiconductors

10:45 - 11:00 Keynote: Talent Development and Innovation

11:00 - 11:30 UJEP University: education and research in chemistry

 

11:30 - 11:45 Break

 

11:45 - 12:15 VSCHT University: education and research in chemistry

12:15 - 12:45 Global Foundries and other companies: needs and requirements of chip manufacturers

12:45 - 13:30 Discussion

13:30 - 14:00 Networking

14:00 - 14:10 Closing remarks

 

Speakers

 

Yuan-Cheng Sun

Prof. Yuan-Cheng Sun, Dean of the Industry Academia Innovation School (IAIS) at National Yang Ming Chiao Tung University and former CTO and vice president for R&D at TSMC. IAIS was established in 2021 as first semiconductor academy on Taiwan with support of industry and government generating talent pool for high-tech industry and boost technology transfer.

Rainer Käsmaier

Since 2018 Dr. Rainer Käsmaier is leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes and Silicon Carbide for market segments such as energy transmission and distribution, transportation and rail, renewables, industry, and eMobility.

Rainer is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing.

After holding leadership roles at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, Rainer took the responsibility for Hitachi Energy’s semiconductor global product group in 2018. Since 2019, he has also served as a member of the management board of Hitachi Energy Switzerland.

He was a member in various industries strategy committees in Europe and the US, and currently in the advisory board for the International Semiconductor Industry Group. Rainer holds a Master’s degree in Physics from the Technical University Munich and a PhD in Physics from the University Kassel in Germany.

He is based in Lenzburg, near Zurich, Switzerland.

 

Thomas Horn

Thomas Horn studied International Economic Relations. In 1994, he started to work as a Project Manager for Saxony Trade & Invest. In this position, he was responsible for Poland, the Baltic States, and Russia. As of 1997, he was the Director of the Saxony Office of the German-Polish Economic Development Corporation. Starting in 2001, he worked in diverse areas and functions on behalf of the Saxon State Ministry of the Environment and Agriculture (SMUL). In 2010, he became the Director for International Relations at the Saxon State Chancellery.

Since 2018, he has been the CEO of Saxony Trade & Invest.

Armin Kemna

Armin Kemna is Vice President of Product Development at Elmos Semiconductor SE. In this role, he is responsible for the strategic direction and implementation of design and development activities for innovative semiconductor solutions, particularly in the automotive sector. Since 2015, he has been instrumental in expanding high-performance analog/mixed-signal platforms, design support structures, and development processes at Elmos. Previously, he led design and technology teams in various roles within the company as well as at research and industry partners.

Kemna holds a degree in electrical engineering and has many years of experience in IC design, sensor technology, and project management.

Jiří Háze

Is an associate professor at the Faculty of Electrical Engineering and Communication, Brno University of Technology, where he serves as Head of the Institute of Microelectronics and Director of the Advanced Chip Design Research Center (ACDRC). His research focuses on the design, modeling, and fabrication of analog and mixed-signal integrated circuits, with a strong emphasis on sensor and biomedical applications. He is actively involved in major European and international initiatives, including the CHIPS of Europe project aimed at strengthening higher-education–industry cooperation in the semiconductor sector, and long-term collaboration with partners in Taiwan through ACDRC.

He has led or co-led more than 15 national and international research projects, published extensively in peer-reviewed journals, and is a frequent invited speaker in the field of chip design and semiconductor technologies.

Karel Masařík

I am a semiconductor deeptech leader working across advanced R&D, product development and ecosystem building. I currently serve as Senior Director, Product Development at onsemi, working on RISC-V adoption and advanced semiconductor technologies across automotive, Safety & Security, edge AI and high-performance computing. I founded Codasip in 2014 and led the company as CEO through 2021, guiding its growth through funding rounds, product and market development, and international expansion. I later served as Chief Innovation Officer, focused on long-term technology strategy and advanced R&D across processor platforms, Safety & Security, automotive, HPC and AI-enabled systems. I also serve as RISC-V Fellow at the Czech Semiconductor Centre, supporting RISC-V, European semiconductor ecosystem engagement and selected EU-level initiatives.

My long-term focus is on strengthening semiconductor capability by connecting technology, research excellence, industrial execution and ecosystem development.

 

Robert Gfrerer

Dr. Robert Gfrerer, MPH is Managing Director of the Silicon Alps Cluster, one of Europe’s leading innovation clusters for electronic and software-based systems. In this role, he drives cross-border collaboration between industry, research, and public stakeholders, strengthening the competitiveness and global visibility of the semiconductor ecosystem in the south of Austria and beyond.
Since 2026, he serves as Chair of the Silicon Europe Alliance, representing Europe's largest network of 16 semiconductor clusters and 3.500 companies. In this position, he actively contributes to shaping Europe’s semiconductor strategy, fostering collaboration across regions, and advocating for industry perspectives in key policy initiatives such as the European Chips Act.
With a background in computer and electrical engineering, combined with a strong track record in leading innovation ecosystems, Dr. Gfrerer has held senior positions across industry, cluster management, as well as startup development. His work focuses on initiating high-impact collaborative projects, enabling access to funding and infrastructure, and building strong innovation networks across Europe.

As a speaker, he brings a strategic European perspective on semiconductor innovation, ecosystem building, and the importance of collaboration in strengthening technological sovereignty and industrial competitiveness.

Jan Jakůbek

Chief Scientist and Co-founder, ADVACAM - Imaging the unseen
Project coordinator and team leader.

Physicist, mathematician, software and hardware designer.
Imaging with ionizing radiation, study of semiconductor detection structures and their applications, radiation spectroscopy, multi-parametric spectroscopy, spectroscopy based imaging, mathematical data analysis, algorithms.
Designing of instrumentation for physical measurements including hardware solutions and related software tools, proof-of-concept measurements, prototyping.

Author of about 500 highly cited articles in scientific journals (more than 10 000 citations).
Many public presentations for international scientific forums. About 15 invited talks in international scientific conferences.

 

Sebastian Lindner

Studied Political Science in Mainz and Leipzig. Held various positions in the fields of culture and public administration at state and federal level. Since 2016, has worked on high-tech issues within the Saxon State Government, particularly microtechnology and AI.

Currently Head of the Division for “Digital Strategies and AI” at the Saxon State Ministry for Economic Affairs, Labor, Energy, and Climate Protection (SMWA).

Sanin Zulić

Sanin Zulić is an experienced leader in business development and commercialization within the photonics and laser industry. As International Business Development Manager at HiLASE, he drives strategic efforts to transform advanced laser technologies into market-ready solutions, focusing on business growth and partnership development.

Sanin’s expertise includes market analysis, customer alignment, and fostering collaborations that accelerate technology deployment. He plays a key role in bridging research innovations with real-world applications, working closely with partners from the semiconductor industry to meet evolving operational needs. His international business experience and strategic insight make him a valuable contributor to advancing the global laser technology ecosystem and driving innovation in semiconductor manufacturing.

 

Petr Slobodian

Prof. Petr Slobodian, Faculty of Technology, Tomas Bata University in Zlín (UTB) and is also affiliated with UTB’s Centre of Polymer Systems, where he leads a research group focused on systems with sensoric properties, particularly sensor material components for hybrid and programmable materials.

His current work explores polymers and nanomaterials and pathways to turn polymer-based systems into conductive and functional semiconductor materials, including research directions connected to soft semiconductors for wearable electronics; he also contributed to the preparation of a new study program on semiconductor materials at UTB.

Ching-Yao Huang

Vice President for the Office of Industry-Academia Co-creation, National Yang Ming Chiao Tung University

 

Jan Lehký

An expert in ESG, construction, and large infrastructure projects. He has long helped investors navigate complex permitting processes and develop sustainable strategies. Actively involved in shaping construction legislation through ministerial working groups, he is one of the leading voices in the Czech ESG regulatory debate.

At seminars and conferences, Jan bridges law, business, and practice—clearly, pragmatically, and without unnecessary legalese.

Lee Eden

Lee Eden has extensive experience in global supply chain, logistics and customer operations. His career has taken him through FMCG, electronics manufacturing & repair, logistics services and industrial equipment sectors.

He managed the Supply Chain function of large manufacturing sites, owning planning, purchasing, warehousing and transportation. Key challenges included reduction 
of inventory and negotiation of liability agreements, resolution of system inventory integrity.
As European Customer Development Manager at Flextronics, Lee developed best practices in Program Management, Pricing and Contract Management. He was responsible for review and confirmation of manufacturing quotations and contracts.

Lee was the EMEA Logistics Manager for Celestica, supporting multiple sites, and Global Director of Logistics Contracts, managing an annual Global freight spend of $70m.

 

Rob Fell

With over 30 years of engineering experience in the Automotive, Semiconductor Industrial Equipment and Telecoms/Consumer Electronics industries, Rob Fell is an established professional with a deep understanding of a wide range of technologies.

Formerly Principal Engineer for Daewoo-General Motors, Rob has partnered with several major global OEMs to develop emerging & innovative technologies that are commonplace on our vehicles today.
Working for a Global leader in Semiconductor industrial equipment manufacture and with commodity responsibility for high-technology components, Rob managed the transfer of a US$100m portfolio of performance-critical parts and assemblies into Asia using extensive supplier development and process capability programmes, underpinned with balanced & mutually beneficial contractual locks.

Previously, Rob has worked in the telecommunications, audio, and consumer electronics sectors where he specialised in the design, development & production of high-end user interfaces.
Now based in Thailand and having lived and worked extensively in the US, Korea, and Japan, Rob additionally brings to Pacellico a deep knowledge of sourcing, supplier development and engineering within the Asia-Pacific region.

Martin Landgraf

Martin Landgraf is a Research Manager at Fraunhofer IPMS, Center Nanoelectronic Technologies (CNT), and has been a driving force since its founding in 2005. With over two decades of experience, he has coordinated numerous R&D projects with global industry partners, specializing in bridging the gap between academic innovation and 300mm industrial manufacturing.

In his current role as Program Manager, he oversees R&D projects, intellectual property, and contract management, reporting directly to the institute's director. His expertise lies in creating effective collaboration models that provide external partners with seamless access to advanced semiconductor infrastructure.

Gateway to the world of semiconductors 

Discover how chips shape the future of technology, innovation and global industries — from AI to automotive and space tech. Watch the video and explore the world behind semiconductors.

Previous years

 

We use cookies to ensure optimal functioning of our website. By continuing to browse the site, you are agreeing to our use of cookies. More information here
}